Shilov, Anton (2008-10-29). "Kingston Rolls Out Industry's First 2GHz Memory Modules for Intel Core i7 Platforms". Xbit Laboratories. Archived from the original on 2008-11-01 . Retrieved 2008-11-02.

Specification Will Encourage Lower Power Consumption for Countless Consumer Electronics, Networking and Computer Products". In addition to bandwidth designations (e.g. DDR3-800D), and capacity variants, modules can be one of the following: Both FBDIMM (fully buffered) and LRDIMM (load reduced) memory types are designed primarily to control the amount of electric current flowing to and from the memory chips at any given time. They are not compatible with registered/buffered memory, and motherboards that require them usually will not accept any other kind of memory. Compared to DDR2 memory, DDR3 memory uses less power. Some manufacturers further propose using "dual-gate" transistors to reduce leakage of current. [10] DDR3 memory utilizes serial presence detect. [26] Serial presence detect (SPD) is a standardized way to automatically access information about a computer memory module, using a serial interface. It is typically used during the power-on self-test for automatic configuration of memory modules.

Speed & Peak Performance

Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866". May 2013 . Retrieved 2019-09-08. DDR3L VDD/VDDQ requirements - Power Supply: DDR3L operation = 1.283 V to 1.45 V; DDR3 operation = 1.425 V to 1.575 V .. Once initialized for DDR3L operation, DDR3 operation may only be used if the device is in reset while VDD and VDDQ are changed for DDR3 operation Another benefit is its prefetch buffer, which is 8-burst-deep. In contrast, the prefetch buffer of DDR2 is 4-burst-deep, and the prefetch buffer of DDR is 2-burst-deep. This advantage is an enabling technology in DDR3's transfer speed.

Kingston's 2,544 MHz DDR3 On Show at Computex, News.softpedia.com, 2010-05-31 , retrieved 2012-01-23 JEDEC Solid State Technology Association announced the publication of Release 4 of the DDR3 Serial Presence Detect (SPD) document on September 1, 2011. [27] XMP extension [ edit ] While the typical latencies for a JEDEC DDR2-800 device were 5-5-5-15 (12.5ns), some standard latencies for JEDEC DDR3 devices include 7-7-7-20 for DDR3-1066 (13.125ns) and 8-8-8-24 for DDR3-1333 (12ns). Salisbury, Andy (2009-01-20). "New 50nm Process Will Make DDR3 Faster and Cheaper This Year". Pcgamer . Retrieved 2009-06-17.According to JEDEC, [11] :111 1.575 volts should be considered the absolute maximum when memory stability is the foremost consideration, such as in servers or other mission-critical devices. In addition, JEDEC states that memory modules must withstand up to 1.80 volts [a] before incurring permanent damage, although they are not required to function correctly at that level. [11] :109

ECC memory, which has an extra data byte lane used for correcting minor errors and detecting major errors for better reliability. Modules with ECC are identified by an additional ECC or E in their designation. For example: "PC3-6400 ECC", or PC3-8500E. [29] In February 2005, Samsung introduced the first prototype DDR3 memory chip. Samsung played a major role in the development and standardisation of DDR3. [2] [3] In May 2005, Desi Rhoden, chairman of the JEDEC committee, stated that DDR3 had been under development for "about 3 years". [4] Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866 (JESD79-3-1A.01) As with earlier memory generations, faster DDR3 memory became available after the release of the initial versions. DDR3-2000 memory with 9-9-9-28 latency (9ns) was available in time to coincide with the Intel Core i7 release in late 2008, [19] while later developments made DDR3-2400 widely available (with CL 9–12cycles = 7.5–10ns), and speeds up to DDR3-3200 available (with CL 13cycles = 8.125ns). The DDR3 standard permits DRAM chip capacities of up to 8 gigabits (Gbit), and up to four ranks of 64 bits each for a total maximum of 16 gigabytes (GB) per DDR3 DIMM. Because of a hardware limitation not fixed until Ivy Bridge-E in 2013, most older Intel CPUs only support up to 4-Gbit chips for 8GB DIMMs (Intel's Core 2 DDR3 chipsets only support up to 2 Gbit). All AMD CPUs correctly support the full specification for 16GB DDR3 DIMMs. [1] History [ edit ]JEDEC Solid State Technology Association announced the publication of JEDEC DDR3L on July 26, 2010 [35] and the DDR3U in October 2011. [36] Feature summary [ edit ] Components [ edit ] Non-registered (a.k.a. " unbuffered") RAM may be identified by an additional U in the designation. [30] How Intel Plans to Transition Between DDR3 and DDR4 for the Mainstream". techpowerup.com . Retrieved 19 March 2018. DDR2 PC2-4200 (commonly referred to as DDR2-533) memory is DDR2 designed for use in systems with a 266MHz front-side bus (providing a 533MT/s data transfer rate). The "4200" refers to the module's bandwidth (the maximum amount of data it can transfer each second), which is 4200MB/s, or 4.2GB/s. The DDR3L ( DDR3 Low Voltage) standard is an addendum to the JESD79-3 DDR3 Memory Device Standard specifying low voltage devices. [31] The DDR3L standard is 1.35V and has the label PC3L for its modules. Examples include DDR3L‐800 (PC3L-6400), DDR3L‐1066 (PC3L-8500), DDR3L‐1333 (PC3L-10600), and DDR3L‐1600 (PC3L-12800). Memory specified to DDR3L and DDR3U specifications is compatible with the original DDR3 standard, and can run at either the lower voltage or at 1.50 V. [32] However, devices that require DDR3L explicitly, which operate at 1.35V, such as systems using mobile versions of fourth-generation Intel Core processors, are not compatible with 1.50V DDR3 memory. [33] DDR3L is different from and incompatible with the LPDDR3 mobile memory standard.

DDR3-xxx denotes data transfer rate, and describes DDR chips, whereas PC3-xxxx denotes theoretical bandwidth (with the last two digits truncated), and is used to describe assembled DIMMs. Bandwidth is calculated by taking transfers per second and multiplying by eight. This is because DDR3 memory modules transfer data on a bus that is 64 data bits wide, and since a byte comprises 8 bits, this equates to 8 bytes of data per transfer. Understanding DDR3 Serial Presence Detect (SPD) Table". simmtester.com . Retrieved 12 December 2015. Alternative naming: DDR3 modules are often incorrectly labeled with the prefix PC (instead of PC3), for marketing reasons, followed by the data-rate. Under this convention PC3-10600 is listed as PC1333. [25] Serial presence detect [ edit ] Chang, Jaci (2004). "Design Considerations for the DDR3 Memory Sub-System" (PDF). Jedex. p.4. Archived from the original (PDF) on 2012-07-24 . Retrieved 2020-08-12. a b Sobolev, Vyacheslav (2005-05-31). "JEDEC: Memory standards on the way". DigiTimes.com. Archived from the original on April 13, 2013 . Retrieved 2011-04-28. JEDEC is already well along in the development of the DDR3 standard, and we have been working on it for about three years now.... Following historical models, you could reasonably expect the same three-year transition to a new technology that you have seen for the last several generations of standard memoryAddendum No. 2 to JESD79-3, 1.25 V DDR3U-800, DDR3U-1066, DDR3U-1333, and DDR3U-1600". October 2011 . Retrieved 2019-09-08. Pc3 10600 vs. pc3 10666 What's the difference – New-System-Build, Tomshardware.com , retrieved 2012-01-23 Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, DDR3L-1600, and DDR3L-1866". May 2013 . Retrieved 2019-09-08. Release 4 of the DDR3 Serial Presence Detect (SPD) document (SPD4_01_02_11) adds support for Load Reduction DIMMs and also for 16b-SO-DIMMs and 32b-SO-DIMMs.